Hi,
I’d like to solder on some SPI flash and use the images that can be created with the v2 buildroot SDK.
Can it be used in parallel to the SD card? Do I need to look for a specific size or is any model OK?
Can it be placed on the ethernet breakout board? I see a space that looks like it’s meant for that.
Do I need special settings for the bootloader?
The largest NOR I tested is 32 MB (W25Q256JVEQ). The breakout board supports only SPI NAND. The largest NAND I tested is 256 MB (W25N02KVZEIR). SD can be used concurrently, but SD takes priority over NAND/NOR on boot. The build system takes care of the changes in U-Boot settings. To be safe you can stick to the documented list, e.g. 12_Sophgo_Flash_Support_List_V3.5.xlsx
Awesome, ty!
A bummer the SD card takes precedence - what if it doesn’t have a bootloader, will it then fall through to SPI?
I’ll get a SPI NAND for the breakout so I can finally solder something to it 
I believe so, but would you like me to try? I’ve only used the SD to ‘flash’ the NAND – leaving that SD inserted results in the flash operation re-running.